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The Importance of Thermal Compression Bonding Technology to Prepare Micro-Coils

The Micro-coil manufacturing method involves the connection between two electrical conductors or wires. As ultra-fine wires are essential for preparing micro-coils, handling these ultra-fine wires is a little difficult. We cannot apply traditional methods to join two ultra-fine wires due to multiple draw-backs. Thermal compression bonding technology is the most competent method for joining two similar or different ultra-fine wires. In fact, you can join a wire with another twelve times thicker wire, and the wires can also be of different materials.

Even though traditional soldering and welding methods were commonly used for joining the wires, these methods are not effective when it comes to connecting two ultra-fine wires of about 8 to 9 microns diameters. Then again, there is a huge demand for the microscopic parts of the sensors and transducers, and you require the connection of ultra-fine wires in order to build these components. There are several constraints that you will face for using the traditional methods. For this reason, most manufacturers are now relying on thermal compression bonding technology. This technology is not only helpful to get rid of multiple environmental and physical constraints but also effective in fulfilling the requirements of an ultra-strict tolerance facility.

Thermal Compression Bonding:

You can create multiple bonding with the help of thermal compression bonding technology. The major connections that you can build through this technology are-

  • For joining the miniature copper thermo-couples with ultra-fine wires.
  • In joining two separate metals of a micro-coil by using a thick intermediary wire and a printed circuit board.
  • When it comes to joining a micro-coil with a support system with the help of metal-plated terminals.

What Are the Benefits of Using Thermal Compression Bonding Technology?

The crucial benefits that the thermal bonding technology can offer you are-

  • This technology is useful for relieving strain at the junctions between two wires.
  • You will have a safe production process for micro-coils and other components with this technology, and there will be fewer risks for the sensitive components to be damaged.
  • In order to get highly reliable and corrosion-free joints, this technology is effective.
  • This technology helps to minimize the noise level.
  • You can use this technology for mass production and minimize your production costs.
  • Above all, you can avoid human errors with the help of automated machinery for this technology.

Constraints of Traditional Methods:

The two main traditional methods for ultra-fine wire connections are-

  1. The welding method: This method uses an electric current to melt and join the metals.
  2. The soldering method: This method involves melting a filler metal by using an external heat source in order to join two wires.

The major constraints that you will face with these methods are-

  • If you use the traditional methods, the ultra-fine wires can be destroyed due to a huge amount of heat spread.
  • There can occur oxidization at the joints of the ultra-fine wires.
  • You can also witness physical strain and degradation in the joints.

Therefore, in order to connect two ultra-fine wires, you should rely on thermal compression bonding technology instead of traditional methods. If you need more explanation on thermal compression bonding, you may visit here.